Origin: Mainland China
Material: Other
Pieces Included: 1
With Magnetic: No
Model Number: BGA Leaded Solder Ball Soldering reballing
Material: Tin
Name: BGA Leaded Solder Ball
Size: 0.2mm/0.25/0.3mm/0.35mm/0.4mm/0.45mm/0.5mm/0.55/0.6mm/0.65mm/0.76mm
Color: Sliver
Condition: Brand New
Weight: app.200g
App to: Laptop, game console, cell phone chip repair reballing
Quantity: 25,000PCS per Bottle
Balls Alloy: Sn63/Pb37
Standard: RoHs Available & SGS Tested
shipping number: 11bottle